Faculty 
Todd Gross, Professor and Chair
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Office: Kingsbury W101A Email: todd.gross@unh.edu Phone: (603) 862-2445 Fax: (603) 862-1865 |
CredentialsPh.D., Materials Science, Northwestern University, 1981B.S., Metallurgy and Materials Science, Carnegie-Mellon University, 1975 |
Prof. Gross is currently the Mechanical Engineering (M.E.) Chair. He is also the academic advisor to all the M.E. freshman during their first year. His open door policy encourages students to contact him whenever they have questions or need help with their courses.
Prof. Gross's research interest is mechanical behavior of materials. His current research is in the areas of development of tougher hard coatings for cutting tools and bearings, nanoscale deformation of high density interconnect structures, measurement of nanoscale dielectric properties and modeling of the effect on signal propagation, and Cu vapor laser cutting. He has special interests in scanning probe microscopy methods and nanoindentation methods.
Prof. Gross teaches Materials Science courses in the Department, including ME 561 - Introduction to Materials Science, ME 730/MS 830- Mechanical Behavior of Materials, ME 731/MS 831 - Fracture and Fatigue of Engineering Materials and ME 744/OE 844 - Corrosion. He also teaches special topic courses in materials science including Polymer Science and Engineering and Materials Synthesis and Characterization, as well as advising senior projects.
Research Areas
- Mechanical behavior of materials
- Hard coatings
- Nanoscale deformation and high density interconnect structures
- Measurement of nanscale dielectric properties and modeling of the effect of signal propagation
- Cu vapor laser cutting
- Scanning probe microscopy methods and nanoindentation methods
Recent Publications
- Numerical Modeling of Grain Boundary Effects in the Diffusional Creep of Copper Interconnect Lines. V.Grychanyuk, I.Tsukrov, T.Gross.
- International Journal of Fracture, vol. 127, pp. L149-L154, (2004) Detection of Plasma-induced, Nanoscale Dielectric Constant Variations in Carbon-doped CVD oxides by Electrostatic Force Microscopy, T. S. Gross.
- K.G. Soucy, E. Andideh, and K.A. Chamberlin, Journal of Physics D, Applied Physics, vol. 35, pp. 723-728, (2002) Finite Element Predictions of the Effect of Diffusion-Accommodated.
- Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures, N.
- Kamsah, T.S. Gross, and I. I. Tsukrov, ASME Journal of Electronic Packaging, vol. 124, pp 12-21 (2002) SPM-generated out-of-plane deformation maps exhibiting heterogeneous nanoscale deformation resulting from thermal cycling of Cu-polyimide damascene interconnects T. S. Gross, N. Kamsah, and I. I. Tsukrov, Journal of Materials Research, vol. 16, pp. 3560-3566, (2001).
- Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density interconnect structures, T. S. Gross, C. M. Prindle, K.A. Chamberlin, N. Kamsah, and Y. Wu, Ultramicroscopy, vol. 87, pp. 147-154, (2001).