I recently had the pleasure of attending the Annual Licensing Executives Society (LES) meeting in Toronto, Canada. Aside from enjoying the local fare and nearby sites, I received the rewarding experience of networking with industry, government and university professionals as well as gaining insight on new licensing opportunities and methods.
Admittedly, the title is a little “cheese ball” but the past two weeks have been a whirlwind of activity in the Office for Research Partnerships and Commercialization (ORPC) as staff members have been involved in numerous events that promote the visibility and mission of our office.
Since the formulation of the patent system with the adoption of the United States Constitution in 1787, the U.S. has focused on awarding a patent to the first inventor to invent. Recently in 2011, President Obama signed into law the America Invents Act (AIA) that changes the preexisting first-to-invent system into a first-inventor-to-file structure. This was an effort to harmonize the U.S. patent system with the European and other patent systems around the world that already use the first-to-file structure.