Conference Presentations: Peer Reviewed

  • Raed Hasan, Tugce Kasikci, Joseph F. Wilson and Brad L. Kinsey* (2012) “Experimental and Numerical Investigation of Key Assumptions in Analytical Failure Criteria for Sheet Metal Forming”, International Manufacturing Science and Engineering Conference, Corvallis, Notre Dame, IN, June 4-8.
  • Chetan Nikhare*, Yannis Korkolis and Brad L. Kinsey (2012) “Numerical Investigation of Residual Formability and Deformation Localization during Continuous-Bending-under-Tension”, International Manufacturing Science and Engineering Conference, Notre Dame, IN, June 4-8.
  • Reid VanBenthysen and Brad Kinsey* (2012) “Effect of Specimen Planar Area on Electromagnetic Flanging”, Proceedings of the North American Manufacturing Research Institute of SME, Notre Dame, IN, June 4-8.
  • Adam Jordan* and Brad Kinsey (2012) “Experimental Methodology to Measure Strain Gradients During  Electrically-Assisted Microbending”, International Conference on Micro Manufacturing (ICOMM), Evanston, IL, March 12-14.
  • Raed Hasan*, Igor Tsukrov, and Brad L. Kinsey (2011) “Effect of Element Type Parameters on Failure Prediction Using a Stress-Based Forming Limit Curve”, International Manufacturing Science and Engineering Conference, Corvallis, Oregon, June 13-17.
  • Lijie Wang, Yannis Korkolis, and Brad L. Kinsey* (2011) “Investigation of Strain Gradients and Magnitudes during Microbending”, International Manufacturing Science and Engineering Conference, Corvallis, Oregon, June 13-17.
  • Tugce Kasikci*, Joseph F. Wilson and Brad L. Kinsey (2011) “Experimental Investigation o Key Assumptions in Analytical Failure Criteria for Sheet Metal Forming”, Proceedings of the North American Manufacturing Research Institute of SME, Corvallis, Oregon, June 13-17.
  • Sunal Parasiz, Reid VanBenthysen, and Brad L. Kinsey* (2010) “Deformation Size Effects Due to Specimen and Grain Size in Microbending”, International Manufacturing Science and Engineering Conference, Erie, PA, Oct. 12-15.
  • Michael S. Siopis, Brad L. Kinsey*, Nithyanand Kota and O. Burak Ozdoganlar (2010) “Effect of Severe Prior Deformation on Electrical-Assisted Compression of Copper Specimens”, International Manufacturing Science and Engineering Conference, Erie, PA, Oct. 12-15.
  • Lijie Wang and Brad L. Kinsey* (2010) "Analytical Prediction of Geometrically Necessary Dislocation Density During Plane Strain Microbending", International Conference on Micro Manufacturing (ICOMM), Madison, WI, April 5-8.
  • Reid VanBenthysen* and Brad L. Kinsey (2010) "Microflanging of CuZn30 Specimens Using Electromagnetic Forming", 4th International Conference on High Speed Forming, Columbus, Ohio, March 9-10.
  • Catherine Mros*, Kavic Rason, and Brad L. Kinsey (2009) "Nanoforming Model of Bulk Metallic Glass Features", 2009 International Manufacturing Science and Engineering Conference, West Lafayette, IN, Oct. 4-7.
  • Michael Siopis and Brad L. Kinsey* (2009) "Effects of Miniaturization on Electrical-Assisted Forming Process", 2009 International Manufacturing Science and Engineering Conference, West Lafayette, IN, Oct. 4-7.
  • Kyle McLaughlin, Tugce Kasikci*, Igor Tsukrov, and Brad L. Kinsey (2009) "Investigation of Stress Concentration Factor in Analytical Stress Based Forming Limit Criterion", 2009 International Manufacturing Science and Engineering Conference, West Lafayette, Oct. 4-7.
  • Richard M. Onyancha, Brad L. Kinsey*, and Ulf Engel (2009) "Development of a New Analytical Model for Plane Strain Microbending", 2009 4M/ICOMM Conference, Karlsruh, Germany, Sept. 23-25.
  • Michael Siopis and Brad L. Kinsey* (2009) "Effect of Grain Size During Electrical Assisted Microforming", 2009 4M/ICOMM Conference, Karlsruh, Germany, Sept. 23-25.
  • Catherine Mros*, Kavic Rason, and Brad L. Kinsey (2008) "Thin Film Superplastic Forming Model for Nanoscale Bulk Metallic Glass Forming", 2008 International Mechanical Engineering Conference and Exposition, Boston, MA, Nov. 1-6.
  • Richard M. Onyancha*, Matthew Derov, and Brad L. Kinsey (2008) "The Anatomy of Spatial Ability Improvement Over the Course of a Semester Long Computer Aided Design Course", American Society for Engineering Education Conference, Pittsburgh, PA, June 22-25.
  • Reid VanBenthysen*, Jonathan Michaud, Peter DiSalvo, Brad L. Kinsey, Michael Blakely, and Jianhui Shang (2008), "Comparison of Microscale Flanging Using Quasi-Static and Electromagnetic Forming Processes", 2008 International Manufacturing and Science Engineering Conference (MSEC), Evanston, IL, Oct. 8-10.
  • Matthew Derov*, Igor Tsukrov, and Brad L. Kinsey (2008) "The Effect of Model Parameters on a Predicted Stress Based Failure Criterion for Sheet Metal", 2008 International Manufacturing and Science Engineering Conference (MSEC), Evanston, IL, Oct. 8-10.
  • Matthew Derov, Brad L. Kinsey*, Igor Tsukrov, and Kunming Mao (2008) "Analytical Model of a Stress Based Failure Criterion and Prediction of Strain Based Forming Limit Curves Using Numerical Simulations", 2008 Numisheet Conference, Interlaken, Switzerland, Sept. 1-4.
  • Sunal Parasiz and Brad L. Kinsey* (2008) "Analytical Model to Predict Geometrically Necessary Dislocation Density During Plane Strain Microextrusion", 3rd International Conference on Micro Manufacturing (ICOMM), Pittsburgh, PA, Sept. 9-11.
  • Michael Siopis*, Brad L. Kinsey, Nithyanand Kota, and O. Burak Ozdoganlar (2008) "Development of Microscale Equal Channel Angular Extrusion Process to Produce Ultrafine Grained Samples", 3rd International Conference on Micro Manufacturing (ICOMM), Pittsburgh, PA, Sept. 9-11.
  • Kavic Rason and Brad L. Kinsey* (2007) "Nanoscale Molding of a Zirconium Based Bulk Metallic Glass", 2007 International Mechanical Engineering Conference and Exposition, Seattle, WA, Nov. 12-15.
  • Sunal Parasiz*, Brad L. Kinsey, Neil Krishnan, and Jian Cao (2007) "Characterization and Investigation of Deformation During Microextrusion Using X-Ray Texture Analyses", International Manufacturing Science and Engineering Conference (IMECE), Atlanta, GA, Oct. 15-17.
  • Richard M. Onyancha* and Brad L. Kinsey (2007) "The Effect of Engineering Major on Spatial Ability Improvements Over the Course of Undergraduate Studies", Frontiers in Education Conference, Milwaukee, WI, Oct. 10-13.
  • Sunal Parasiz*, Brad L. Kinsey, Neil Krishnan, Numpon Mahayotsanun, and Jian Cao (2007) "Effects of Miniaturization on Deformation during Microextrusion", 2nd International Conference on Micro Manufacturing (ICOMM), Clemson, SC, Sept. 10-13.
  • Richard M. Onyancha and Brad L. Kinsey* (2007) "Improvement of Spatial Ability Using Innovative Tools: Alternative View Screen and Physical Model Rotator", American Society for Engineering Education Conference, Honolulu, Hawaii, June 24-27.
  • Richard M. Onyancha* and Brad L. Kinsey (2006) "Investigation of Size Effects on Process Models for Plane Strain Microbending", International Manufacturing Science and Engineering Conference, Ypsilanti, Michigan, Oct. 8-11.
  • Richard M. Onyancha* and Brad L. Kinsey (2006) "Size Effects in Micromanufacturing Process Models: Microbending and Microextrusion", International Conference on MicroManufacturing, Urbana-Champaign, Illinois, Sept. 12-15.
  • Brad L. Kinsey*, Erick Towle, Grace Hwang, Edward J. O'Brien, and Christopher F. Bauer (2006) "The Effect of Spatial Ability on the Retention of Students in a College of Engineering and Physical Science", American Society for Engineering Education Conference, Chicago, Illinois, June 19-23.
  • Aaron Sakash and Brad L. Kinsey* (2006) "Evaluation of Stress Saturation Effect with a Stress Based Failure Criterion for Sheet Metal Using Numerical Simulations", SAE World Conference and Exposition, Detroit, MI, April 4-7.
  • Neil Krishnan*, Jian Cao, Sunal Parasiz, Brad L. Kinsey, and Ming Li, (2005) "Investigation of Deformation Characteristics of Micropins Fabricated Using Microextrusion", 2005 International Mechanical Engineering Conference and Exposition, MED-81511, Orlando, FL, Nov. 5-9.
  • Robert E. Williams*, Yong Huang, Shreyes Melkote, Brad L. Kinsey, Wei Sun, and Donggang Yao, (2005) "Recent Advances in Micro/Meso-scale Manufacturing Processes", 2005 International Mechanical Engineering Conference and Exposition, MED-79889, Orlando, FL, Nov. 5-9.
  • Sumit Moondra, Aaron Sakash, and Brad L. Kinsey* (2005) "Numerical Simulation Support for a Stress-based Failure Criterion", 2005 International Mechanical Engineering Conference and Exposition, AMD-80317, Orlando, FL, Nov. 5-9.
  • Erick Towle, Jennifer Mann, Edward J. O'Brien, Christopher F. Bauer, Robert Champoux, and Brad L. Kinsey*, (2005) "Assessing the Self Efficacy and Spatial Ability of Engineering Students from Multiple Disciplines", Frontiers in Engineering Education Conference, Oct. 19-22, 2005, Indianapolis, IN.
  • Erick Towle, Jennifer Mann, and Brad L. Kinsey*, (2005) "Work In Progress ' Development of Tools to Improve the Spatial Ability of Engineering Students", Frontiers in Engineering Education Conference, Oct. 19-22, 2005, Indianapolis, IN.
  • Brad L. Kinsey*, Matt Bravar, and Neil Krishnan (2004) "Comparison of Analytical Model to Experimental Results and Numerical Simulation for Tailor Welded Blank Forming", Proceedings of the International Mechanical Engineering Conference and Exposition (IMECE), Paper AMD-59322, Anaheim, CA, Nov.
  • Brad Kinsey*, Matt Bravar, and Jian Cao (2003) "Methodology and Model to Determine Key Process Parameters for Tailor Welded Blank Forming", Symposium on Metal Forming: Microscale to Macroscale, Proceedings of the International Mechanical Engineering Conference and Exposition (IMECE), Paper AMD-43610, Washington, D.C., Nov.
  • Brad Kinsey* (2003) "Design of a CAD Integrated Physical Model Rotator", Proceedings from the 2003 ASEE Annual Conference, Nashville, TN, June.
  • Brad Kinsey* and Neil Krishnan (2002) "Using FEA Simulations to Determine Advanced Process Parameters for Tailor Welded Blank Forming", A Glimpse into the Future of Sheet Metal Forming, Proceedings of the International Mechanical Engineering Conference and Exposition (IMECE), Paper #34361, New Orleans, Louisiana, Nov.
  • Brad Kinsey* and Jian Cao (2001) "Numerical Simulations and Experimental Implementation of Tailor Welded Blank Forming", Second Global Symposium on Innovations in Materials Processing & Manufacturing: Sheet Materials, 2001 TMS Annual Meeting.
  • Kathleen Issen*, Brad Kinsey, L. Catherine Brinson, and Linda Broadbelt (2001) "Preparing Future Engineering Faculty: A Professional Development Series", 2001 ASEE Annual Conference and Exposition.
  • Brad Kinsey* and Jian Cao (1999) "An Advanced Manufacturing Process for Tailor Welded Blank Forming", 1999 ASME Congress and Exposition Nashville, TN, Nov. 15-19.
  • Brad Kinsey*, Nan Song, and Jian Cao (1999) "Analysis of Clamping Mechanism for Tailor Welded Blank Forming", 1999 SAE International Body Engineering Conference, SAE Paper No. 1999-01-3192, Detroit, MI, Sept. 28-30.
  • Brad Kinsey* and Jian Cao (1997) "An Experimental Study to Determine the Feasibility of Implementing Process Control to Reduce Part Variation in a Stamping Plant", Sheet Metal Stamping: Developments in Sheet Metal Stamping, SP-1221, SAE Paper 970713, pp. 107-12.