Dale P. Barkey
Dale Barkey, Professor
Education
Ph.D., Chemical Engineering, University of California at Berkeley, 1987
M.S., Chemical Engineering, University of Cincinnati, 1982
B.A., Chemistry, Clark University, 1979
Research Interests:
- Electrodeposition, Anodizing, Electrochemical Engineering.
Courses Taught:
- Advanced Heat Transfer, Corrosion, Introduction to Chemical Engineering, Thermodynamics
Recent Publications:
- E. Garcia-Cardona, E.H. Wong and D. P. Barkey , NMR Spectral Studies of Interactions between the Accelerants SPS and MPS and Copper Chlorides, Journal of the Electrochemical Society, 158 D143 (2011).
- D. Barkey and J. McHugh, Pattern Formation in Anodic Aluminum Oxide Growth by Flow Instability and Dynamic Restabilization, Journal of the Electrochemical Society, 154, C388 (2010).
- Z. Zhang and D.P. Barkey, Nucleation of Tin and Tin-Silver Alloy on Copper and Nickel in Acid Plating Baths, Journal of the Electrochemical Society, 154, D550 (2007).
- K. Kondo, T. Yonezawa, D. Mikami, T. Okubo, Y. Taguchi, K. Takahashi and D. Barkey, High-Aspect-Ratio Copper-Via-Filling for Three- Dimensional Chip Stacking -2) Reduced Electrodeposition Process-Time, Journal of the Electrochemical Society, 152, H173 (2005).
- M.A. Pasquale, D.P. Barkey and A.J. Arvia, Influence of Additives on the Growth Velocity and Morphology of Two Dimensional Copper Electrodeposits, Journal of the Electrochemical Society, 152, C149 (2005).